报告题目：Soft Magnetic Film Application to Improve Power & Signal Integrity in IC Chip

报  告 人：山口正洋（Masahiro YAMAGUCHI） 教授

报告时间：2019年10月24日（周四）上午10:00

报告地点：子良楼B4会议室

邀 请 人：功能材料研究所 车声雷教授

报告人简介：

       Masahiro Yamaguchi received his BSc., MSc. and Ph D. in electrical engineering from Tohoku University, Japan in 1979,1981 and 1984, respectively. In 1984, Dr. Yamaguchi joined the Department of Electrical Engineering, Tohoku University as Assistant Professor. In 1990, Dr. Yamaguchi became Associate Professor at the Research Institute of Electrical Communication, Tohoku University. During October-December 1995, he joined Department of Electrical and Computer Engineering, University of Wisconsin-Madison, USA, as a Visiting Associate Professor. Since 2003, Dr. Yamaguchi works for the Department of Electrical Engineering, Faculty of Engineering, Tohoku University as a full Professor. His interest covers high frequency magnetic materials and applications, and EMC.

He was awarded Best symposium paper award at APEMC2015 in 2015, IEC 1906 Award in 2018, Division-A Outstanding Scientific & Contribution Award, The Institute of Electrical Engineers of Japan in 2019 and Achievement award, The Magentics Soceity of Japan in 2019.

He was the 2016-2017 Chair of IEEE EMC Society Sendai Chapter, and also awarded 2017 Chapter of the Year award. He is 2018-2019 Chair of IEEE Magnetics Society Sendai/Sapporo Joint Sectoin Chapter, a TPC member of 2018 IEEE PELS Power-Supply-on-Chip Workshop, EMCCompo2019, Joint MMM/Intermag 2019, and currently the President-Elect of IEEE Magnetics Society.

报告内容摘要：

As the 5G telecommunication system is being implemented to practical use soon, possible desensitization of receiver circuit of a cell phone handset is interested because of increasing unnecessary radio waves. This talk discusses a new magnetic material technology to countermeasure desensitization by means of ferromagnetic resonance losses of magnetic material.

 Test materials are sputter-deposited CoZrNb film and ferrite composite materials. Sputtered film was directly deposited on to passivisation of bare Si-die whereas composite material was applied on IC chip interposer. These materials are used as frequency variable resistor for conduction noise suppression. Performance was evaluated by input loss ratio, Ploss / Pin, on the microstrip line based on IEC 62333-2. It is clarified that this new noise suppressors have excellent noise suppressing function in the GHz band.